Printed Circuit Board Assembly
- Design review up front with process engineering to improve reliability DFM and DFT feedback ● Component sourcing assistance
- High Mix specialists ● Scalability and full life cycle support including aftermarket
- Expert Purchasing Management supports obsolescence management, component alternatives, full cycle material management
- BOM control, Build to qualified parts list ● Revision control/change management
- Full Turnkey & Consigned Material Management
- High complexity / High Reliability Production
- Lean Manufacturing focus
- Contract Review & Internal Disciplines, Procedures that support Operational Excellence
- IPC Class 2 and 3 workmanship standards ● Customer specifications
- In House Trainer-Certified IPC-610 & 620 and J-STD-001 workforce
- DFT (Design for Test) assistance ● Test development assistance
- Critical Process Control- Defect Prevention
- First Pass Yield Data Tracked and provided to work centers
- First Article review- Certified to customer requirements
- SMT (Surface Mount Technology) and PTH (Plated Through Hole) & Mixed Technology
- Automated SMT and Through –Hole lines with placement capabilities 0201 packages to large scale,Precision BGAs/CBGAs: MyData Pick-n-Place- TP9-2U; TP12; TY19-Hydra
- X-Ray Inspection and expert BGA/QFN process verification- Glenbrook Technologies RTX-113
- BGA and Micro BGA Rework and Repair Station
- Ace Technologies K.I.S.S.- 103 Semi- automatic selective soldering
- RoHS Compliance with Tin-Lead Manufacturing
- Rigid and Semi Rigid
- ESD control
- AOI (Automated Optical Inspection) Mirtec MV-3L
- Flying Probe- SPEA 4050S2m State-of -the-Art
- Conformal Coating to specification; spray, dip and brush applications & potting
- Device Programming in house