Printed Circuit Board Assembly

Our focus is to understand the application, provide design for manufacturability, and process engineering support for new designs. Component sourcing feedback provided up front. Together with state of the art equipment, processes and expertise, we provide end–to-end manufacturing and supply chain support.

Design review up front with process engineering to improve reliability DFM and DFT feedback ● Component sourcing assistance
High Mix specialists ● Scalability and full life cycle support including aftermarket
Expert Purchasing Management supports obsolescence management, component alternatives, full cycle material management
BOM control, Build to qualified parts list ● Revision control/change management
Full Turnkey & Consigned Material Management
High complexity / High Reliability Production
Lean Manufacturing focus
Contract Review & Internal Disciplines, Procedures that support Operational Excellence
IPC Class 2 and 3 workmanship standards ● Customer specifications
In House Trainer-Certified IPC-610 & 620 and J-STD-001 workforce
DFT (Design for Test) assistance ● Test development assistance
Critical Process Control- Defect Prevention
First Pass Yield Data Tracked and provided to work centers
First Article review- Certified to customer requirements

SMT (Surface Mount Technology) and PTH (Plated Through Hole) & Mixed Technology
Automated SMT and Through –Hole lines with placement capabilities 0201 packages to large scale,Precision BGAs/CBGAs: MyData Pick-n-Place- TP9-2U; TP12; TY19-Hydra
X-Ray Inspection and expert BGA/QFN process verification- Glenbrook Technologies RTX-113
BGA and Micro BGA Rework and Repair Station
Ace Technologies K.I.S.S.- 103 Semi- automatic selective soldering
RoHS Compliance with Tin-Lead Manufacturing
Rigid and Semi Rigid
ESD control
AOI (Automated Optical Inspection) Mirtec MV-3L
Flying Probe- SPEA 4050S2m State-of -the-Art
Conformal Coating to specification; spray, dip and brush applications & potting
Device Programming in house